Intel 1000W CPU Immersion Liquid Cooling System Launched

      On October 18th, 2023, Intel announced the launch of an immersive liquid cooling system with Submers, called the "Forced Convection Heat Sink (FCHS)," which can cool chips with thermal design power of 1000W and above.
     It is reported that in this submerged liquid cooling system, two fans are installed at one end of a copper radiator to enhance the flow of liquid through the radiator through forced convection. However, the design of this component contradicts the traditional passive concept of submerged heat dissipation based on natural convection. In the initial stage, Intel used a Xeon server processor with a TDP of 800W for demonstration, and the next step is to increase the TDP to 1000W. In addition, this immersion liquid cooling system incorporates features of ease of manufacturing and cost-effectiveness in its design, and some components can also be manufactured using 3D printing to better customize corresponding heat dissipation designs.