Telecom Industry

According to MarketsandMarkets data, the global semiconductor thermoelectric device market is expected to grow from $593 million in 2021 to $872 million in 2026, with a compound annual growth rate of

5G network has become a key development direction in the field of communication due to its three recognized advantages of ultra-high speed, low latency, and massive connectivity. The high performance

With the rapid growth of single cabinet power in global data centers, the average power has jumped to 16.5kW from 2008 to 2020, and is expected to reach 25kW by 2025. This growth has put higher demand

The first step in the thermal design and development process is to confirm which cooling method the product needs to use, in order to reserve corresponding design space in the early stage of the produ

A chip usually refers to an integrated circuit chip, which integrates multiple electronic components onto a small silicon wafer. The chip has powerful functions and can achieve complex computing and c

With the development of technology, energy efficiency has become an important indicator for measuring chip performance. Small chips consume less energy overall due to their lower energy requirements a

A vapor chamber is composed of sealed copper plates and filled with a small amount of fluid (such as deionized water), allowing heat to quickly dissipate from the heat source. The vapor chamber heat s

With the continuous promotion of 5G construction, 5G base stations and servers will carry massive data processing and transmission requirements. The increase in working power consumption has made the

With the rapid development of 5G technology, efficient cooling and thermal management have become important challenges in the design of 5G base stations. In this context, 3D VC technology (3D two-phas

The vapor chamber heatsink is composed of sealed copper plates and filled with a small amount of fluid (such as deionized water), allowing heat to quickly dissipate from the heat source. The uniform t

With the rapid development of 5G technology, efficient cooling and thermal management have become important challenges in the design of 5G base stations. In this context, 3D VC technology (three-dimen

As data centers respond to the growing demand for artificial intelligence workloads, high-performance computing, and edge deployment, the limitations of traditional air cooling have become apparent. A