Servers &Networking

The data center is composed of server, UPS system, battery, AC power supply device, DC power supply device and cooling system. In order to ensure the smooth operation of various equipment and prevent

The development of high-performance electronic system puts forward higher and higher requirements for thermal capacity. The traditional thermal solution is to attach the heat exchanger to the heat sin

GPU, also known as graphics card or VGA, is an indispensable component of every computer or server . Without graphics card, we will not be able to see images. It can be seen that the graphics card pla

With the advent of the era of 5g Internet of things, the demand for high-performance and high-density computing is accelerating, and the problem of data center energy consumption is becoming increasin

The AI craze is surging, and the era of computing power is rapidly approaching. As a computing infrastructure, servers are developing towards high-performance, low energy consumption, and diverse comp

The power consumption of cutting-edge AI chips is constantly increasing, which has become a catalyst for the next generation of DGX AI servers to shift towards liquid cooling. The current TDP (thermal

Under the dual carbon strategy, enterprises are increasingly valuing green investment. Many companies attach great importance to investing in green construction of data centers, but often overlook the

Recently, Nvidia announced that it will release a new Blackwell architecture B100 GPU at the upcoming GTC2024 conference. According to internal sources, the B100 has achieved a significant improvement

The AI craze is surging, and the era of computing power is rapidly approaching. As a computing infrastructure, servers are developing towards high-performance, low energy consumption, and diverse comp

The first step in the thermal design and development process is to confirm which cooling method the product needs to use, in order to reserve corresponding design space in the early stage of the produ

With the release of the new generation of chips, their technology and performance are becoming increasingly outstanding, but this is also accompanied by a terrifying problem - a sharp rise in chip tem

At present, the heat dissipation module is mainly composed of active and passive hybrid heat dissipation technology containing thermal pipes. The heat pipe heat dissipation module is designed and comb