PS5 Gaming Cooling Design

   We know that the PS5, Sony's upcoming next-generation host, is the most robust of all previous hosts. The main reason is to dissipate heat. In order not to reproduce the noise of PS4, Sony attaches great importance to the thermal cooling of ps5 host and spends a lot of money and time to study various means. The cooling solutions in ps5 are not only hardware, but also software.

     In terms of hardware, a large double-sided fan with a diameter of 120mm and a huge copper heat pipe radiator are adopted. Although the volume of ps5 is a little larger, in order to meet the requirements of strong heat dissipation performance, some space has to be sacrificed.

      The interior space is designed with steam chamber cooling, and liquid metal is used on the back of the processor! The SOC on ps5 operates at ultra-high frequency. Due to the high thermal density of silicon wafer, the performance between SOC and cooling conductor must be greatly improved. Therefore, replacing the grease between the semiconductor chip and the system heatsink with liquid metal can reduce the thermal resistance between the two parts of the host and improve the cooling performance of the chip!

     The GPU and CPU of ps5 can operate at variable frequency, and the power supply now provides stable power flow for the main chip, system components and fans. On this premise, the method of using game update dynamics to control the fan speed is flexible for heat dissipation. Sony uses real-time data to monitor the system temperature of the ps5 and let the update dynamics of online games change the fan speed.

     The PS5 has very little noise when running, and the loading time of the game is very fast, which fully reduces the noise on the premise of effective heat dissipation. It can be seen that the effective thermal design can not only ensure the stable performance output of the equipment, but also increase the user's satisfaction.