Semiconductor Heat Dissipation New Technology Improves Heat Dissipation by 25%
According to reports, South Korean engineers have discovered a new heat transfer mode using surface plasmon polaritons (SPPs), making a significant breakthrough in semiconductor thermal management. This new method increases heat dissipation by 25%, which is crucial for solving the overheating problem of small semiconductor devices.
The need to reduce the size of semiconductors, coupled with the issue of heat generated at device hotspots not being effectively dispersed, has had a negative impact on the reliability and durability of modern devices. The existing thermal management technology is not yet competent for this task. Therefore, discovering a new method of utilizing surface waves generated by metal films on substrates to dissipate heat is indeed an important breakthrough.
SPP refers to the surface wave formed by the strong interaction between the electromagnetic field at the interface between the dielectric and the metal, as well as free electrons and similar collective vibrating particles on the metal surface. Specifically, the research team utilized SPP (surface waves generated at the metal dielectric interface) to improve the thermal diffusion of nanoscale metal films. Due to the fact that this new heat transfer mode occurs when metal thin films are deposited on the substrate, it is very useful in the device manufacturing process and has the advantage of being able to be manufactured on a large scale.
This result has significant implications for the development of high-performance semiconductor devices in the future, as it can be applied to rapid heat dissipation on nanoscale thin films. Especially, the new heat transfer mode discovered by the research team is expected to solve the basic problem of thermal management in semiconductor devices, as it can achieve more effective heat transfer at nanoscale thicknesses, and the thermal conductivity of thin films is usually reduced due to boundary scattering effects.
