skived fin heatsink application in IGBT thermal design

     IGBT is the core device of energy conversion and transmission, commonly known as the "CPU" of power electronic devices. It is widely used in rail transit, smart grid, aerospace, electric vehicles and new energy equipment. Sinda thermal can provide professional heat dissipation solutions on demand according to the characteristics of high instantaneous heating power and intermittent operation of IGBT.

     In this case, we took a detailed study accroding to customer's space requirements, product structure, product cost, diversity of product use environment and other characteristics. Finally ,we adopted the skived fin process, and selected pure aluminum with high thermal conductivity and good processing performance as the base material of the IGBT heatsink.

      From the design, it not only ensures the base thickness of the  radiator, but also can absorb the instantaneous heat in time when the IGBT works, and then conduct it in time by using the high density fin surface, so as to quickly dissipate heat through air convection.

    The skiving process is characterized in that the fin piece is integrated with the base bottom. Compared with the traditional gear shaper or adhesive process, it reduces the risk of large thermal resistance between the fin piece and the base  due to other media. The high density fin  layout can not only ensure that the product has sufficient heat dissipation surface area, but also ensure the air fluidity between the fins, so that the system air duct can flow through each fin gap. Even if there is no system fan, it can ensure a good heat radiation channel, which is conducive to heat flow.