SSD cooling solution

       With the development of nvme technology, m.2 SSD can go through PCI-E channel, with rapid performance, breaking through the SSD speed bottleneck of traditional SATA interface. Moreover, m.2 SSD has become the mainstream choice in the current market by virtue of its inherent advantages of light weight and small size, as well as the standard m.2 slot on the latest desktop / notebook motherboard.

     A large number of long-term scientific tests show that 50 ℃ - 55 ℃ is the most suitable working temperature for SSD. If the temperature is too high, the performance will decline, which may lead to data transmission failure and even hard disk damage. For example, many people still remember the experience that the ultra-high heating capacity of Samsung 950pro led to a great discount in the later transmission.

       Excessive temperature not only threatens the product life cycle, but also causes a series of problems when running for a long time. Therefore, various DIY heat dissipation has become the choice of players, and manufacturers directly launch products equipped with heat dissipation schemes.

Heatsink design on SSD:

     The principle of the heat sink is simple. Most of them are composed of a pure aluminum or aluminum alloy heat sink with a length of 22 * 80mm and a piece of thermal conductive silicone grease. They can be used on most m.2 SSDs with different lengths from 22 * 42mm to 22 * 80mm.

       A large number of fins or laminated surface designs can often increase the heat dissipation area of the heatsink, so as to take away more heat. When purchasing m.2 SSD heat sinks,  the heat dissipation area design also needs attention.

Fan cooling :

     M. 2 SSDfan cooling , usually assembled with a small fan, which is installed on the aluminum heat sink. The three dimensions are 81.5 × twenty-four point five five × The 23.1mm air-cooled module can reduce the SSD temperature by 25%.

SSD liquid cooling:

     Liquid cooling is a new cooling method for m.2 SSD applications in recent years.Its interior is a closed system, which is divided into two chambers. After the liquid in the flash memory chip and the main control chamber is heated, it flows to the second chamber (with aluminum fins outside). After the temperature is reduced, it returns and circulates back and forth.

     At the same time, properly improve the heat dissipation inside the lower chassis and strengthen the air circulation inside the chassis, which can accelerate the heat removal and achieve the purpose of cooling.