The application of ceramics Substrate
Circuit board is regarded as the mother of electronic products by many people. It is the key component of Consumer electronics such as computers and mobile phones. It is widely used in medical, aviation, new energy, automobile and other industries. Throughout the brief history of development, every technological advancement directly or indirectly affects all humanity. Before the birth of circuit boards, electronic devices contained many wires that would not only entangle and occupy a large amount of space, but also short circuits were not uncommon. This issue is a very headache for circuit related staff.
With the birth of integrated circuit technology and the entry of the era of advanced electronic manufacturing, PCB has gradually become an essential core product in the industry. The rapid development of integrated circuit technology has gradually put forward different performance requirements for circuit boards. As electronic devices continue to shrink, it has also led to higher PCB preparation processes in mechanical manufacturing. At present, PCBs on the market can be mainly divided into three types based on material categories: ordinary substrates, metal substrates, and ceramic substrates. A regular substrate is the motherboard we usually see in computers and mobile phones. It is made of regular epoxy resin substrate, which has the advantage of easy design and low cost.
At present, electronic devices are developing towards high-power, high-frequency, and integrated directions. Their components generate a large amount of heat during the working process. If these heat cannot be dissipated in a timely manner, it will affect the efficiency of the chip and even cause damage and failure of semiconductor devices. Therefore, to ensure the stability of the working process of electronic devices, higher requirements are put forward for the heat dissipation ability of circuit boards. Traditional ordinary substrates and metal substrates cannot meet the applications in the current working environment. Ceramic substrates stand out for their excellent insulation performance, high strength, low coefficient of thermal expansion, excellent chemical stability, and thermal conductivity, which meet the performance requirements of current high-power device equipment.
In the future, electrical devices, industrial manufacturing technology, and high-power equipment will develop rapidly, and the power density of equipment will continue to increase. The issue of heat dissipation will continue to be of concern to industry professionals worldwide. At the same time, solving the heat dissipation problem of more advanced devices and equipment in the future will put forward stricter requirements for materials. Ceramic substrates, with their excellent thermal conductivity, insulation, and thermal expansion coefficient matched with silicon, will continue to emit light and heat as heat dissipation and structural components in the future.
Ceramic substrates have advantages such as good heat dissipation, heat resistance, thermal expansion coefficient matching with chip materials, and good insulation, and are widely used in high-power electronic modules, aerospace, military electronics, and other products. Equipped with high-power IGBT and SiC power devices, it stimulates the demand for upstream ceramic substrates and promotes industrial development.
