Thermal design of electronic packaging

       With the development of electronic products towards high integration, high performance and multi-function, there are more and more I / O lines of chips, the speed of chips is faster and faster, and the power is also getting higher and higher, which leads to a series of problems such as the increase of device temperature and power density. Using CAE technology, the performance of electronic devices can be predicted, and the structural dimensions and process parameters can be optimized, so as to improve product quality, shorten product development cycle and reduce product development cost.

      The following is a brief introduction of CFD simulation technology in solving some common engineering problems in the R & D process of electronic packaging:

1. Analysis of temperature distribution in chip package.

2. Analysis of heat flow path in chip package.

3. Simulation analysis of thermal resistance under JEDEC standard after chip packaging.

     In the thermal design of chip packaging, we need to consider the heat transfer performance of chip packaging with different structures, and provide chip packaging model for board level or system level thermal analysis. Icepak software can directly generate the detailed structure model of the chip according to the information of ECAD software, which is convenient for engineers to predict the temperature distribution and thermal optimization design of chip packaging.