Thermal design of military electronic equipment
With the rapid development of science and technology, the electronic equipment involved in the field of national defense and military equipment is becoming more and more complex, cutting-edge and intelligent. At the same time, due to the requirements of military applications for product miniaturization, lightweight, customization and high reliability, engineers are faced with a series of challenges in the design process, such as millimeter wave electromagnetic compatibility, cooling and heat dissipation under high heat flux, sealing in harsh environment and so on.
Thermal design challenges of military equipment:
1. The working environment of military equipment is complex. Altitude, high temperature, low temperature, humidity, temperature shock, solar thermal radiation, shock vibration, ice, and various harsh environments (fungi, desert, dust, soot, etc.) have varying degrees of impact on its thermal design. In addition to complex boundary conditions, the biggest challenge of thermal management of electronic products in national defense industry is to encounter transient thermal shock. These electronic products are often in an extreme thermal environment.
2. Large treatment and high calorific value. Due to the nature of military tasks, these electronic products are bound to bear a large amount of data processing. At the same time, they require a faster data processing speed, which is correspondingly low, and the heat consumption of electronic products will increase sharply. Therefore, the bad environmental conditions and the sharp increase of chip heat consumption make the thermal management of electronic products in national defense industry face great challenges.
3. Lightweight and perfect reliability increase the difficulty of thermal design. For electronic equipment in the atmosphere or outer space environment, weight is a very important element. The lighter the weight, the longer the product continues to work and the lower the cost.
Military device thermal design:
Due to the high heat consumption and poor working environment of military electronic products, chips usually show higher heat flow. Similar to other electronic products, they must have a good cooling system, in which the requirements of equipment working space size, weight, heat consumption, electromagnetic shielding and so on must be considered. At present, many engineers prefer to use hybrid cooling for thermal design of electronic products. Most electronic chips use air cooling for heat dissipation, and liquid cooling for devices with great heat consumption. However, for space flight or outer space electronic devices, this cooling way is not desirable, and a more compact liquid cooling system must be designed. For example, using substrate materials with high thermal conductivity,vapor chamber, heat pipe, TEC embedded in chip die, jet cooling or direct immersion liquid cooling can transfer heat to the liquid and then to the heat exchanger of the liquid cooling system.
