Thermal solution design of PCB
Based on the consideration of heat dissipation, PCB is better to be installed vertically. Generally, the distance between boards shall should not be less than 2cm, and the arrangement order of components on PCB shall follow certain rules, listed as follows:
1. For the equipment cooled by free convection air, it is better to arrange the integrated circuits (or other components) in a longitudinal manner; For the equipment with forced air cooling, it is best to arrange the integrated circuits (or other components) in a transverse length manner.
2. The components on the same PCB shall be arranged in zones according to their calorific value and heat dissipation degree as far as possible. The components with low calorific value or poor heat resistance shall be placed at the upstream of the cooling air flow, and the components with high calorific value or good heat resistance shall be placed at the downstream of the cooling air flow.
3. In the horizontal direction, high-power components are arranged as close to the edge of PCB as possible to shorten the heat transfer path; In the vertical direction, high-power components should be arranged as close to the top of PCB as possible, so as to reduce the impact of these components on the temperature of other components when they work.
4. The components sensitive to temperature should be arranged in the area with the lowest temperature (such as the bottom of the equipment), and should not be placed directly above the heating components. Multiple components should be staggered on the horizontal plane.
5. The heat dissipation of PCB in the equipment mainly depends on the flow of air, so we should consider studying the flow path of air and configuring components or PCB reasonably. When a few devices in the PCB have large heating capacity, a radiator or heat transfer pipe can be added to the heating device. When the temperature cannot be reduced, a radiator with fan can be considered to enhance the heat dissipation effect.
6. When heat-resistant components with the same level are mixed and arranged, the basic arrangement order is: components with high power consumption and components with poor heat dissipation should be installed at the upwind outlet.
7. When air flows, it always tends to flow in places with low resistance. Therefore, when configuring components on PCB, it is necessary to avoid leaving a large airspace in a certain area. The same problem should be paid attention to in the configuration of multiple PCBs in the whole machine.
8. PCB circuit board shall be made of plates with good heat dissipation.
9. Using reasonable wiring for heat dissipation .
Sinda Thermal locate in Dongguan, we covers an area of 20000 square meters, And total about 300 employees cover sales, design ,engineering ,quality production department ; 31sets 2 to 5-axis CNC machines,4 sets skiving machines,4 production lines, 25 sets stamping machines and 3 reflow soldering oven.
Our main products cover DC fan, heatpipe thermal module, different kinds of heatsink,liquid cooling plate, dust fan. ODM and OEM service. Please contact us if you need any thermal issue help .
website: www.sindathermal.com
contact:castio_ou@sindathermal.com
Wechat: +8618813908426
