ultrathin vapor chamber application in cell phone

      After heat pipe cooling, vapor chamber  technology has been widely used in medium and high-end mobile phones. Its biggest advantage is thin, because mobile phones have higher and higher requirements for internal space. At present, 0.3mm ultra-thin VC has been successfully applied to mobile phones and has reached a stable process level of mass production.

      Compared with laying copper mesh or copper powder sintered capillary core structure, a 0.3mm ultra-thin vapor chamner is developed by using the precision etching microstructure integrated capillary core process, which reduces the overall thickness by about 50um, which not only simplifies the process, but also reduces the cost, making it possible for the VC soaking plate to enter 5g medium and low-end mobile phones.

      At the same time, due to the special structural design and advanced technology, the liquid absorption capacity of the etched capillary core reaches the liquid absorption height of 13.5cm, and the liquid absorption speed is 8mm / s, which can support the heat dissipation power of 5W, which can fully meet the heat dissipation requirements of daily electronic products such as mobile phones.

    Vapor chamber is also a representative of phase change heat conduction. It is also a heat dissipation unit made of pure copper, which is internally sealed and hollow (the inner wall is not smooth, full of capillary structure) and filled with condensate. However, its shape is not a flat "strip" of heat pipe, but a wider flat "sheet". The working principle of VC soaking plate is similar and different from that of heat pipe, but it generally includes four steps: conduction → evaporation → convection → solidification.