Vapor Chamber Technology

     The heat pipe is one-dimensional linear heat conduction, while the heat in the vapor chamber is conducted on a two-dimensional surface, so the efficiency is higher. Specifically, after absorbing the heat from the chip, the liquid at the bottom of the vapor chamber evaporates and diffuses to the vacuum cavity, transmits the heat to the heat dissipation fins, and then condenses into liquid and returns to the bottom. The evaporation and condensation process similar to that of refrigerator and air conditioner circulates rapidly in the vacuum chamber, realizing quite high heat dissipation efficiency.

Working Process:

1. The base of the vapor chamber is heated, and the heat source heats the copper mesh micro evaporator - heat absorption.

2. The liquid (purified water) is heated in the vacuum ultra-low pressure environment and evaporates rapidly into hot air - heat absorption.

3. Vacuum chamber is  vacuum design, and hot air flows more rapidly in the copper mesh micro environment - heat conduction.

4. The hot air rises when heated, dissipates heat when it reaches the cold area on the upper part of the radiating plate, and recondenses into liquid - heat dissipation.

5. The condensed liquid flows back to the evaporation source at the bottom of the vapor chamber through the copper micro structure capillary pipe, this reflux cycle will repeat  during the application device working.

      We're now seeing more and more customer using vapor chamber design in the new thermal solution , such as Ultra thin performance note book , XBOX ,smart phone ,precision medical equipment,etc. Vapor chamber sink can bring higher thermal conductive performance than the heatpipe assembly in limited space, but the cost will also be higher.With the development of thermal industry , and the improvement of manufacturing. Vapor chamber will be more and more popular in thermal design.