Vapor Chamber working Principle
Working principle：
The vapor chamber is a vacuum cavity with fine structure on the inner wall, which is usually made of copper. When the heat is transmitted from the heat source to the evaporation area, the coolant in the cavity begins to vaporize after being heated in the environment with low vacuum. At this time, it absorbs heat energy and expands rapidly. The gas-phase cooling medium quickly fills the whole cavity. When the gas-phase working medium contacts a relatively cold area, condensation will occur. The heat accumulated during evaporation is released by the condensation phenomenon, and the condensed coolant will return to the evaporation heat source through the microstructure capillary pipe. This operation will be repeated in the cavity.
Strurture:
VC heatsi k is usually used for electronic products that need small volume or rapid cooling. At present, it is mainly applicable to servers, high-end graphics cards and other products. It is a strong competitor of heat dissipation mode of heat pipe. The appearance of the vapor chamber is a flat plate-shaped object, the upper and lower parts are respectively provided with a cover close to each other, and the inner part is supported by a copper column. The upper and lower copper sheets of the VC are made of oxygen free copper, usually pure water as the working fluid, and the capillary structure is made by copper powder sintering or copper mesh process.
As long as the vapor chamber maintains its flat plate characteristics, the modeling outline depends on the environment of the applied heat dissipation module, and there is no restriction on the placement angle during use. In practical application, the temperature difference measured at any two points of the plate can be less than 10 ℃, which is more uniform than the heat pipe to the heat source. Therefore, the name of temperature equalizing plate comes from it. The thermal resistance of common temperature equalizing plate is 0.25 ℃ / W, which is applied to 0 ℃ ~ 150 ℃.
Applications:
Due to the mature technology and low cost heat pipe cooling module, the current market competitiveness of vapor chamber is still inferior to that of heat pipe. However, due to the rapid thermal performance increase of the VC, its application is aimed at the market where the power consumption of electronic products such as CPU or GPU is more than 80W ~ 100W. Therefore, the vapor chamber is mostly customized products, which is suitable for electronic products requiring small volume or rapid heat dissipation. At present, it is mainly applicable to servers,cell phone, high-end graphics cards and other products. In the future, it can also be applied to the heat dissipation of high-end telecommunications equipment and high-power LED lamps.
Advantages and Benefits:
The small volume can make the heatsink control as thin as the entry-level low power consumption; Heat conduction is fast, which is less likely to lead to heat accumulation. The shape is not limited, and can be square, round, etc., which is suitable for various heat dissipation environments. Low starting temperature; Fast heat transfer speed; Good temperature equalizing performance; High output power; Low manufacturing cost; Long service life; Light weight.
