You must know the heat dissipation method of the CPU cooler

     1. Fin: 

     It is the largest area on the radiator. The area of the fin mainly affects the maximum heat dissipation ability of passive heat dissipation.

     Because the temperature propagation is from hot to cold, when the CPU generates high temperature, it begins to spread through the metal on the base of the radiator and diffuses from the high temperature area to the low temperature area. Therefore, the larger the area of the fin, the more The more low-temperature zones of this radiator (the heating temperature of common metals will not be higher than that of the CPU at room temperature, so it is a low temperature zone compared with the CPU with high heating), the higher the theoretical average heat absorption, and the stronger the passive heat dissipation ability will naturally be. At present, a very small part of it is called a 0 decibel radiator. The so-called 0 decibel radiator is the way to absorb the CPU temperature and rely on air to dissipate the fin area of passive heat dissipation.         

     Of course, the heat dissipation ability and materials of the fin are also related. At present, the best fin material is copper, because of its high thermal conductivity, followed by aluminum.          

     2.Heat pipe: 

     Simply put, the heat pipe is used to connect the fin pipe on the base connected to the radiator and the CPU. The heat pipe directly means the transient maximum transient heat conductivity of this radiator.

     Therefore, basically, the heat pipe also determines the level of the radiator. Whether it belongs to the low-end or middle-end radiator, because no matter how large the fin area is, the active radiator will Strong, when the heat pipe can't conduct the temperature on the CPU to the fin in vain! ( Of course, after meeting the transient heat conduction, no matter how many heat pipes are, it is futile to rely on fins and active heat dissipation to cool down) But you can't simply say that the low-end radiator is not as good as the middle end. For example, absolutely speaking, the radiator of the 2 heat pipe is not as good as the 4 heat pipes. This is wrong, because under the case of the CPU heating is not high, the 2 heat pipe radiator only needs the fin area. The air volume of the active radiator is greater than that of the 4 heat pipe, and its heat dissipation capacity is bound to exceed that of the 4 heat pipes. The material of the heat pipe is basically copper, which has no impact, but the process of heat pipe shuttle fins and the base shuttle process have an impact. The tighter the basic shuttle, the better the thermal conductivity. In addition, the heat pipe shuttle fins in different areas enables all fins to conduct heat equally and enhance heat dissipation. The name of each brand of the heat pipe base shuttle process is different. It mainly determines whether the heat pipe is exposed. The heat pipe exposed 0 distance contact with the CPU can best conduct heat, while the ordinary heat pipe technology is relatively poor in thermal conductivity.         

      Active heat dissipation basically refers to the fan on the radiator. The fan generates air volume and directly takes away the heat from the fins. This is active heat dissipation. The effect of active heat dissipation is better than passive heat dissipation, but active heat dissipation is maintained by fan operation, so it generates noise. After the middle, the heat dissipation efficiency is relatively high. You can absorb the air and blow the air at the same time, which is very efficient. Basically, the middle fan can produce the effect of mute or active heat dissipation enhancement. The fan hanging on an ordinary radiator can only be blown or sucked.