20pcs Vapor Chamber Heatsink Samples Are Under Thermal Test
Last week, we received an sample order demand of 20pcs copper vapor chamber heatsink for 5G application from Japan customer. This is pure copper material which can support 120W TDP, and will be higher if soldered with a stamping fin stack. The 20pcs vapor chamber samples are now under themral performance test, we will finish the final packing and ship to customer site by tomorrow.
Vapor Chambers leverage high heat transport capabilities of two phase cooling in a planar format. This makes Vapor Chamber Assemblies ideal components when spreading high heat densities or heat loads across a larger surface. By using Vapor Chambers, you can expect increased and more uniform heat spreading, which is ideal when optimizing heat sink performance.
