Aluminum Folder Fin Heatsink Inquiry From Japan Customer

        Today, we received an inquiry for the aluminum folder fin heatsink from  the Japan customer. The heatsink contains an aluminum fold fin and a base,  it is for automation device cooling application. We will update the quotation to customer soon , thanks for the support to Sinda Thermal. 

      Folded fin technology can manufacture thinner fins than extrusion and bonded fin process, compared with zipper fins and skiving fins, folded fin has more surface area due to the structure. For some high power electronic components or industrial applications, heat pipe is a essential component to improve the thermal performace as its excellent heat transferring ability.