EK Launches The World's First Chip Direct Contact Integrated Liquid Cooling, Suitable For The Intel LGA1700 Platform

   At this year's CES 2024, EK teamed up with overclocking cooling expert Roman "der8auer" to create the world's first chip direct contact integrated liquid cooling - EK-Nucleus AIO CR360 Direct Die D-RGB-1700. From the name, it can also be seen that this is an integrated water-cooled heat sink designed specifically for open cover Intel LGA 1700 processors.

 This heat sink is very similar to the company's 360mm Lux model, but its liquid-cooled pump head uses a special customized heat dissipation plate that can be fully in contact with the chip. It is recommended to use it with Thermal Grizzly's Condondonaut liquid gold thermal paste.