New EVAC Heatsink Design For ODM Customer

    EVAC means Extended Volume Air Cooling , With increased processor cores and performance for CPU/GPU, thermal design power (TDP) of these products are also increasing .Traditional air-cooling seems not able to support higher TDP with limited size and spece, and liquid cooling solutions are still too expensive for mass production.Hence advanced air-cooling solutions like Extended Volume Air Cooling (EVAC) heat sinks are more ideal to adopt.

      Recently , we just finished design the new server heatsink to certain ODM customer ,and it's used for server CPU applications. Drawing spec were sent to customer for final check , and we will start the 2pcs prototype sample build as soon as customer confirmed the 3D drawing. Thanks for choosing Sinda Thermal as your thermal solution partner.

 •Design Requirements

–CPU TDP support: 200-500W

–Tcase Target 200-350W: 70C (0.0857 C/W assuming 40C inlet to heatsink)

–Tcase Target >350-500W: TBD

–Approach Temperature: 40°C (35°C ambient + 5°C storage preheat)

–1U System Airflow: 80-150 CFM

–2U System Airflow: 100-275 CFM

•Design Considerations

–Required chassis depth – design for smaller CEM if possible

–Long term reliability – designs should have equivalent reliability to existing heatsinks

–Shock & vibration – consider requirement for additional mounting point to support remote fin assembly

–Preheat – remote fin assemblies will likely result in increased preheat to system memory, this may require localized bypass channels (this can be considered at a later date).

–Separate designs having of different size may be required to fulfill the required TDP range of 200-500W.  Suggest to develop designs for 200-350W and >350-500W.