Rapid Thermoforming Ceramics Are Expected To Be Used For Electronic Products Cooling

     In July 2021, researchers were testing an experimental ceramic compound. When subjected to extreme thermal change and mechanical pressure, ceramics are prone to fracture or even explosion due to thermal shock. When using a blowtorch to spray ceramic, it deforms. After several experiments, the researchers realized that they could control its deformation. So they began to compress and shape ceramic materials and found that this process was very fast.

    This new product has the potential to bring two industry improvements. Firstly, it has high efficiency as a thermal conductor and can cool high-density electronic products. Researchers believe that in the future, this all ceramic material can be used for shaping and bonding to various electronic components. This type of ceramic will be thinner, lighter, and more efficient than the metals currently used.