Samsung Exynos 2400 Chip Adopts Advanced Thermal Technology

    Recently, Samsung announced that its latest flagship phones, the Galaxy S24 and S24+, will be equipped with its own Exynos 2400 processor in some markets, which is produced using various new technologies. The Exynos 2400 adopts Samsung's latest 4LPP+process, which not only improves the yield rate but also significantly enhances the energy efficiency of the chip.

 
    The Exynos 2400 is Samsung's first smartphone SoC to adopt FOWLP packaging, which brings many benefits to it. Packaging technology can enable Exynos 2400 to have more I/O connections, making electrical signal transmission faster. At the same time, due to the smaller packaging area, the heat dissipation performance has also been significantly improved. Simply put, smartphones equipped with Exynos 2400 can run for long periods of time without overheating issues. Samsung claims that using FOWLP technology can increase the heat dissipation capacity of Exynos 2400 by 23%, resulting in an 8% increase in multi-core performance.