Samsung Exynos 2500 Is Expected To Use HPB Cooling Technology

   According to media reports, Samsung's packaging business team is developing a packaging technology called FOWPL-HPB, which is expected to be completed and ready for mass production in the fourth quarter of this year. The core of this technology is a cooling module called Heat Path Block (HPB), which is a cooling technology already used for servers and PCs and is now expected to be applied for the first time on smartphone SoCs. HPB technology significantly improves processor heat dissipation by attaching a hot path block at the top of the SoC.

    It is expected that FOWPL-HPB technology will also be the first to be applied to the Exynos 2500 processor, further improving its performance. This also means that in the context of the increasing demand for end side generative AI, Samsung is addressing the issue of mobile processor performance being limited by overheating. In addition, Samsung Electronics plans to further develop FOWPL-HPB based technology next year and aims to launch a new FOWLP-SiP technology that supports multi chip and HPB by the fourth quarter of 2025.