About Thermal design, thermal test, thermal simulation
With the development of miniaturization, intelligence and diversification of electronic and electrical products, the power density of products is becoming higher and higher, and the design cycle of products is becoming shorter and shorter, which brings severe challenges to the heat dissipation design of products. At present, more and more enterprises choose to speed up product development by means of simulation and test, aiming to reduce the number of tests and verifications, shorten the development cycle and reduce the risk of product design.
In addition, as the power consumption and heat dissipation parameters of semiconductor equipment are related to material composition and manufacturing process, and are related to ambient temperature and temperature rise, it is necessary to recalibrate the heat dissipation characteristics of components with the help of thermal testing equipment.
Thermal Design:
The thermal design of electronic equipment is based on the power consumption, temperature characteristics and application scenarios of electronic components, using heat transfer technology and corresponding structural equipment, so that the operating temperature of components does not exceed the required range of their normal operating temperature, and meets the reliability requirements of components on the heat dissipation path. Usually, the thermal design needs to obtain the key heat transfer performance parameters with the help of thermal testing technology, and the simulation technology can evaluate and optimize the thermal design.
Thermal Test:
Thermal test is a testing technology. With the help of professional testing equipment and methods, it can obtain the thermal resistance characteristics of all parts on the one-dimensional cooling path of the product, and provide reliable data for heat dissipation design evaluation and simulation analysis.
In the thermal design of electronic products, the purpose of thermal test is mainly to test whether the actual thermal performance of the product can meet the expected requirements, test the rationality of the product thermal solution, and evaluate the reliability of the product process. In addition, the thermal test technology can also evaluate the optimization potential and cost reduction, test the actual performance of the product in different schemes and in different environments, and conduct regression in combination with its theoretical design and simulation analysis to guide the subsequent heat dissipation design.
Thermal Simulation:
Thermal simulation technology is to analyze the heat transfer phenomena such as electric heating, conduction, convection, radiation and phase change involved in the working environment of the virtual physical prototype with the help of CFD technology, and predict the heat dissipation characteristics of the product. Thermal simulation technology can be applied to different stages of products:
1. Quickly verify and optimize the design idea in the design and R&D work.
2. In the detailed design stage, virtual testing is carried out before sample forming to solve most problems, and the efficiency is increased by minimizing trial and error during sample testing, so as to help the later product optimization and achieve cost reduction and efficiency increase.
3. The problems exposed in the product operation and maintenance stage can be explored and reproduced to improve the design and reliability.
Thermal design, thermal simulation and thermal test run through the whole design and R & D cycle of the product to build stronger technical capabilities for R & D and design. In the whole process of design and development, the simulation and test are combined to obtain and verify the data, and then the product is optimized based on the analysis results.
