Annular cooling pump thermal technology
Recently, Xiaomi officially launched a future oriented heat dissipation technology: annular cold pump heat dissipation technology.It is understood that it refers to the heat dissipation mode of Aerospace Satellite, pumps the coolant to the heating area of mobile phone, and makes the heat conduct at high speed through vapor-liquid phase change, forming a smooth one-way cooling loop. This technology realizes twice the heat dissipation capacity of VC and is the strongest passive heat dissipation system of mobile phone so far!
This technology is a leapfrog improvement of mobile phone heat dissipation. It is understood that the annular cold pump is composed of evaporator, condenser, compensation chamber and steam and liquid pipes. The evaporator is located in the heat source area of mobile phone motherboard. When the processor and other heat sources operate under high load, the cold liquid evaporates into vapor state and drives the air flow into the steam pipe through natural expansion.
When the steam flows into the condenser, it condenses into liquid, which is sucked into the liquid pipe through capillary force, and then returns to the compensation chamber to make up the cold liquid for the evaporator. In this way, no external power is required.
Although the phase change principle is the same as that of VC liquid cooling, the actual effect is very different due to different structures. Conventional VC liquid cooling can not separate vapor from liquid, so the hot steam moving to the condenser and the cold liquid flowing back to the evaporator move towards each other and hinder each other. It is easy to have difficulty in liquid reflux under high load.
At the same time, due to the special steam pipeline design, the airway resistance of the annular cold pump is greatly reduced by 30% and the steam flow is smoother, so that the directional long-distance cold end transmission of heat can be realized and the maximum heat transfer power can be increased by 100%.
