Application of thermal PAD in network switch

      With the rapid development of science and technology, our society has entered the information age. In this society, the network has become an indispensable part of people's life. With the rapid development of the information age and the gradual popularization of cloud services, the amount of data storage in all walks of life has increased rapidly due to the popularization of cloud services. Large capacity expansion of servers also brings more switch requirements. 

      Network switch is an important part of connecting server and network equipment and building data center. Due to the high density of network devices caused by the popularity of cloud services, the number of connected devices has increased, which makes the load of switches greater. The new switch faces the problem of balancing performance improvement and reducing power consumption.

   The industrial switch integrates MAC switching module, PHY interface chip, main control chip, memory and other devices. Due to the fatal impact of excessive temperature on industrial switches, when designing such products, in addition to selecting industrial components with wide temperature range, we should pay full attention to the thermal design of equipment.

    In order to meet the reliability application requirements of industrial switches, most of the whole machine adopts fan less heat dissipation design. For chips with large heating capacity, thermal PAD and thermal conductive phase change material can be used to fill the gap between the contact surface and form a thermal conductive channel from the chip surface to the shell, so as to ensure that the chip works in a safe temperature range and that the switch can work reliably and safely in a high temperature environment.

      Thermal cinductive PAD is mainly used for heat conduction and heat dissipation between main board and shell. The main purpose of selecting thermal PAD is to reduce the contact thermal resistance between the heat source surface and the contact surface of heatsink parts. Thermal conductive PAD can well fill the gap of the contact surface; With the supplement of thermal conductive silicon film, the contact surface between the heat source and the radiator can be in better and full contact, so as to truly achieve face-to-face contact, and the temperature response can achieve as little temperature difference as possible; Thermal PAD not only has insulation performance, but also has the effect of shock absorption and sound absorption.