5G cell phone thermal solution
There are two types of mobile phone heat dissipation: active and passive. The basic idea is to reduce the thermal resistance of mobile phone heat dissipation (passive heat dissipation) or reduce the heating capacity of mobile phone (active heat dissipation). Active heat dissipation is realized by reducing the power consumption and heat of the chip, which is related to the research and development of electronic equipment. Passive heat dissipation is achieved by heat conducting materials and devices. The components that generate heat of the mobile phone are mainly CPU, battery, motherboard, RF front end, etc. the heat generated by these components will be introduced into the interlayer with large heat capacity by the heat sink, and then dissipated through the mobile phone shell and heat dissipation hole.
As electronic products become lighter and thinner, their heat dissipation capacity is limited due to the narrow internal space of the body. The main heating sources on smart phones include these five aspects: main chip work, LCD drive, battery release and charging, CCM drive chip, PCB structure design, uneven heat conduction and heat dissipation.
In order to solve these heat dissipation problems, the heat dissipation technologies in the market mainly include the following solutions:
Graphite sheet heat dissipation:
Most of the thermal solution in smart phones use graphite sheet heat dissipation design, but with the increase of heat dissipation demand of electronic equipment, the heat conduction of single-layer or double-layer graphite sheet can not meet the higher heat dissipation demand.
Graphene heat dissipation:
Graphene has excellent thermal conduction ,and its heat dissipation efficiency is much higher than that of commercial graphite fins. Graphene heat dissipation film is very thin, flexible and excellent in comprehensive performance, which makes it possible for the thin development of electronic products. Secondly, graphene heat dissipation film has good reprocessability and can be compounded with other film materials such as pet according to its application.
Heatpipe :
Heat pipe is a kind of heat transfer element with high thermal conductivity. It transfers heat through the evaporation and condensation of liquid in a fully enclosed vacuum pipe. In the mobile phone industry, it can also be called water cooling. Heat pipe has the characteristics of high flexibility and long service life, which has attracted market attention.
Vapor Chamber:
Vapor Chamber is similar to heat pipe in principle, but it is different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the vapor chamber is conducted on a two-dimensional surface, so the efficiency is higher.
Thermal Pad:
It is a highly active heat absorbing material. From the side, a good microporous structure is formed inside the material. This microporous structure makes it not only have a strong heat absorbing function, but also have the function of active heat dissipation!
The flexibility of Thermal Pad makes up for the shortcomings of metal heat dissipation device, so as to achieve core sticking protection, and the effect is ten times better than that of ordinary thermal grease.
