Brief introduction of Thermal Pad Cooling

   With the rapid development of thermal PAD, high-tech advanced electronic products in the market change quickly and are very popular among consumers. The accessories used in the installation of electronic products are particularly important, including the selection of some auxiliary factors, such as thermal conductivity. Any electronic product will produce a lot of heat during operation. If the product has long service life and good customer experience, the internal heat dissipation and heat conduction process of the design product is inevitable. At present, the more widely used heat conductive silica gel sheet, heat conductive adhesive and heat dissipation silica gel are widely used by many electronic manufacturers.

     The thermal PAD is specially used to fill the gap and thermal conductive powder to complete the connection between the heat source and the heat dissipation component, so as to transfer heat and achieve the effect of heat dissipation. The application of thermal conductive PAD will not only play the role of heat dissipation, but also play the role of insulation, shock absorption and reinforcement in components. It is a better choice for the design and development of ultra-thin electronic products.

   The thermal conductivity of metal products is much higher than that of thermal conductive silicone sheets. Why not use metal to conduct heat directly, and use thermal PAD. CPU and heat sink are common heat dissipation combinations in daily life. If  using metal , there will be gaps unless the heat sink and CPU are integrated. As long as there is a gap, any heat conduction solution is very difficult to achieve the heat conduction effect, and the softness of the thermal PAD is adjustable, the compression performance is very good, and any gap can be filled to obtain better heat conductivity.