ChatGPT promotes high computing power scenarios such as AI, leading to an explosion in demand for cooling technology
The promotion of ChatGPT technology has further promoted the popularization of high-power application scenarios such as AI computing power. By connecting a large number of corpora to train models and achieve scene functions such as human-computer interaction, a large amount of computing power is required as support. With the slowing down of Moore's Law, the chip computing power and power consumption have significantly increased, and air-cooled cooling technology faces great challenges.
According to CDCC data, the thermal conductivity of liquids is 15-25 times that of air. With the increase in thermal density, liquid cooling is expected to replace air cooling to achieve more efficient heat dissipation. Market insiders say that the development of AIGC is expected to bring explosive growth demand for computing power, and the improvement of computing power will bring higher chip cooling demand, which is expected to bring about an explosion of chip level liquid cooling demand.
Nowadays, many technological applications in society still rely on the development of artificial intelligence, such as medical robots, industrial assembly line robots, LED industries, and so on. Even people's daily use of mobile phones and computers has related applications, so the development of artificial intelligence has promoted the development of society. Therefore, artificial intelligence is known as the new engine of economic development, which puts forward higher requirements for its overall thermal management plan.
When AI high computing servers work, their internal components generate a large amount of heat, especially the server chips. In order to ensure the stable operation of the server, the working temperature of high-performance ARM SoC (CPU+NPU+GPU), hard disk and other components should be controlled within the allowable range, in order to effectively ensure that the server has good working capacity and a longer working life. Due to higher power density, heat dissipation through advanced thermal management material systems is crucial for meeting new functional standards.
