high density electronic device cooling ways

Brief introduction of cooling technology:

       The cooling  technology of industrial equipment is actually the cooling technology of high-density assembled electronic equipment. It's principle of electrical heat dissipation. When the temperature is too high during industrial equipment running, it is necessary to maintain and protect itself by reducing its performance. With the development of industrial technology, the density of industrial automation assembly has become closer and closer. This also shows that in the production process, the temperature of the equipment will rise with the production operation. If measures are not taken for the rising temperature in time, the electronic equipment will be damaged over time. The cooling technology of high-density assembled electronic equipment can cool the equipment in time, which can not only ensure the smooth operation of the equipment, but also prolong the service life of the equipment. In the design stage of electronic equipment, we can make a comprehensive analysis according to the characteristics of electronic equipment and the types of heating elements, calorific value, working environment and other factors, and determine which cooling mode to adopt.

Cooling technology problems:

    Electronic devices will generate heat during production and operation. Our mainly goal is how to reduce the heat generated by the equipment and the cooling technology to dissipate the heat in time. Its goal is to control the temperature of all components inside the electronic equipment, so that the electronic equipment can not exceed its maximum allowable working temperature in a specific environment, and maintain stable and efficient operation. Due to the high density of high-density assembled electronic equipment chips, concentrated heat, poor working environment, coupled with the influence of factors such as component cost and selection, many industrial devices are used in harsh environment, so the cooling system has also become simple, so the problems faced by today's cooling technology are more severe.

Cooling technology of high density assembled electronic equipment:

      Sidewall liquid cooling technology.The side wall liquid cooling technology designs a liquid cooling channel on the side wall of the cabinet for high-density assembly of electronic equipment. At the same time, the opposite side wall is filled with coolant to maintain a low temperature on the side wall of the cabinet through heat exchange. The heat generated by the electronic equipment chip is transmitted to the side wall through the internal module structure shell. The coolant inside the side wall absorbs the heat and brings the heat out to the outside of the electronic equipment. Its working principle is shown in the figure. The coolant is generally water, No. 65 coolant, kerosene, etc. these materials have good fluidity and large specific heat capacity. During the flow process, they can absorb a large amount of heat from the side wall of the electronic equipment cabinet, and bring the heat out of the electronic equipment, so as to provide a good working environment for the electronic equipment.

  Through liquid cooling technology. Through liquid cooling technology is to design the liquid cooling channel into the shell of high-density assembly electronic equipment module structure, pass coolant to the shell, and keep the shell of module structure at a low temperature through heat exchanger. The heat generated by the electronic equipment chip is transmitted to the module structure shell through the interface material, and then transmitted to the coolant through the heat dissipation shell. The coolant absorbs the heat and brings the heat out to the outside of the electronic equipment. The coolant is generally made of the same materials as the side wall liquid cooling. In the process of liquid passing, it can absorb a large amount of heat from the shell of the module structure and bring the heat out of the electronic equipment, so as to provide a good working environment for the chip. Compared with side wall liquid cooling technology, through liquid cooling technology can take away more heat.

      Microchannel cooling technology. Generally, the channel with equivalent diameter greater than 1mm is called ordinary channel, and the channel with equivalent diameter less than 1mm is called microchannel. Compared with ordinary channels, the biggest advantages of microchannels are: large heat exchange area and high heat exchange efficiency. Microchannel cooling technology can solve the heat dissipation problem of chips with high local power consumption by designing the traditional fluid channel into microchannel in the area of concentrated heating of high-density assembled electronic equipment modules.

   Phase change cooling technology. Based on the principle that phase change materials absorb a large amount of heat in the process of melting from solid state to liquid or even gaseous state, the rise of chip temperature in high-density assembled electronic equipment can be delayed within a certain time, so that the electronic equipment can work normally within a certain time. Phase change materials generally have the characteristics of high melting latent heat, high specific heat capacity, high thermal conductivity and no corrosion.

    Interface material with high thermal conductivity and low thermal resistance.High thermal conductivity and low thermal resistance interface materials are mainly composed of silicone grease, silica gel, phase change materials, phase change metals, etc. these materials have high thermal conductivity and are very soft. Therefore, installing this material between components and cold plates can effectively improve the thermal conductivity and reduce thermal resistance of high electronic equipment, so as to ensure the normal operation of electronic equipment.

       High density electronic equipment must be cooled in time during operation. Local hot spots can be controlled by reducing heat consumption and selecting effective heat dissipation methods. In the design of heat dissipation mode, different cooling modes shall be adopted according to the characteristics of the equipment to ensure the normal operation of the equipment. At the same time, the path thermal resistance can be reduced by adding high thermal conductivity and low thermal resistance interface materials, so as to ensure the high and reliable operation of electronic equipment, prolong the service life and reduce the operation cost.