High density PCB assembly thermal solution
Most industrial automation equipment will generate a certain amount of heat as long as it starts to work, such as CNC machine , electrical cabinets, cooling and heating boxes, etc. when the heat accumulates to a certain state, the temperature of electrical equipment will gradually increase, which will reduce the performance of electrical components, and in serious cases, it will cause equipment failure and even damage electrical equipment, Therefore, the temperature control of electrical equipment has always been an important part of the design, especially for high-density electronic equipment. The use of high-density assembled electronic equipment cooling technology can automatically adjust the temperature of industrial automation equipment, prolong the service life of equipment, maintain the quality of electronic equipment and save resources and costs.
The cooling technology of high-density assembled electronic equipment is the heat dissipation technology of industrial automation equipment. This technology follows the cooling and heat dissipation principle of electrical appliances. When the temperature of industrial automation equipment is too high, it can automatically adjust the temperature to maintain the quality of the equipment. The use of high-density assembled electronic equipment cooling technology can reduce the temperature of industrial automation equipment to a certain extent and prolong the service life of the equipment.
Chip cooling structure:
If the chip volume of high-density assembled electronic equipment is very small,it does not have heat dissipation capacity, the heat will be too concentrated during use,which will lead to chip melting or failure. Therefore, the chip cooling structure can be used to ensure good heat dissipation performance and transfer the heat on the chip to the outside in time. The cooling effect of the semiconductor cooling and heating box is the chip cooling structure used. One end of the cooling and heating box can release heat and the other end can absorb heat for cooling. The structure of the cooling and heating box is very simple, safe and reliable. Unlike refrigerators and HVAC, mechanical compressors and condensing agents are required for refrigeration, which can save a lot of power resources and be easy to carry.
Microchannel cooling:
Microchannel cooling is a cooling and heat exchange technology. For chips with equal area, the smaller the channel, the greater the heat dissipation per unit time. Therefore, when microchannel cooling technology is adopted, the channel will be reduced as much as possible to improve the heat dissipation effect. Generally, silicon with thermal conductivity will be used as the channel material to closely arrange the microchannels, Maintain a good heat dissipation environment for industrial automation equipment.
Low resistance thermal interface material:
The low thermal resistance interface material can absorb the heat of the chip. The TIM is a material that can reduce the contact thermal resistance. Its essence is to provide a smooth heat dissipation path for other media and heat sources. It is mainly a synthetic material composed of thermal conductive silicone grease, thermal conductive adhesive, thermal conductive elastomer, phase change material and low melting point alloy. Therefore, the thermal conductivity is very high, The installation of this material can effectively assist the heat dissipation of electronic equipment and ensure the normal temperature of the equipment.
Module cooling structure：
The module cooling structure is to make the module into the first heat sink of the chip and create an external environment for heat dissipation for the chip. In order to maintain the normal operation of the heat dissipation system, when designing the module cooling structure, we must pay attention to improving the thermal performance of the module, reducing the heat transfer resistance and optimizing the module structure.
Spray cooling technology:
The spray cooling technology combines the convection heat transfer with the phase change. The nozzle can make the cooling medium atomize and spray it to the equipment that needs cooling. The cooling medium will vaporize after absorbing the heat, then it can be recycled inside the electronic equipment and keep the normal temperature of the equipment. This technology configuration is relatively free, the control method is very flexible, and the core is the nozzle design. The nozzles shall be set according to the chip size of the equipment. Generally, the nozzles will be grouped and stacked to form a nozzle row, so as to compress the system volume, reduce the burden of electronic equipment and maintain the smooth operation of heat dissipation air flow.
Integrated industrial air conditioning：
Many traditional electrical equipment are equipped with axial fans, but with the increasing density of electrical equipment, it is impossible to install too many and too large axial fans for temperature regulation due to the limitation of installation space; At present, the industrial integrated air conditioner can be used for forced cooling of electrical equipment. It has been proved to be a very effective method. The disadvantage is that it will increase the manufacturing cost of the equipment. At the same time, the use cost of the equipment will increase because the industrial air conditioner will consume electric energy during operation, but from the current use situation, the effect is the best.
High density pcb assembly electronic equipment cooling technology is a thermal cooling technology for industrial automation equipment. This technology can reduce the heat of the equipment during operation, prolong the service life of the equipment and improve the service quality of the equipment. To give full play to the role of high-density assembly electronic equipment cooling technology, it is necessary to use chip cooling structure to maintain the normal operation of the heat dissipation system, In this way, high-density assembly electronic equipment can be fully maintained and cost resources can be effectively saved.
