Vapor Chamber Cpu Cooler

  The vapor chamber is usually used for electronic products that require a small volume or need to quickly dissipate huge heat. At present, it is mainly used in products such as servers and high-end graphics devices. It is a strong competitor of heat pipe cooling method. The vapor chamber is a flat plate-like shape in appearance, with a cover on the top and bottom of each other tightly.

  There is copper pillar support inside. The upper and lower copper sheets on the vapor chamber are made of oxygen-free copper, usually pure water as the working fluid, and the capillary structure is made by the process of copper powder sintering or copper mesh. As long as the temperature equalizing plate maintains its flat characteristics, the shape of the outer shape depends on the application of the heat dissipation module environment, and there is no restriction on the angle of placement when used. In actual application, the temperature difference measured at any two points on the plate can be less than 10°C, which is more even than the heat conduction effect of the heat pipe on the heat source, and the name of the uniform temperature plate is henceforth. The thermal resistance of the common temperature equalizing plate is 0.25℃/W, and it is applied to 0℃～150℃.

Product information

The Working principle of vapor chamber

  The vapor chamber is a two-phase fluid device formed by pouring pure water into a container full of micro structures. Heat enters the plate through heat conduction from the external high temperature area, and the water around the point heat source will quickly absorb the heat and be vaporized into steam, taking away a large amount of heat energy. Reusing the latent heat of water vapor, when the vapor in the plate spreads from the high pressure area to the low pressure area (ie, low temperature area), when the vapor touches the lower temperature inner wall, the water vapor will quickly be condensed into a liquid and release heat energy. The condensed water flows back to the heat source by the capillary action of the microstructure, completing a heat transfer cycle, forming a two-phase circulation system in which water and steam coexist. The vaporization of the water in the uniform temperature plate continues, and the pressure in the cavity will maintain a balance as the temperature changes. Water has a lower thermal conductivity value when it is operated at low temperatures, but because the viscosity of water changes with temperature, the soaking plate can also operate at 5°C or 10°C. Since the liquid return is effected by capillary force, the vapor chamber is less affected by gravity, and the application system design space can be used at any angle. The temperature equalizing plate does not require power supply or any moving components. It is a completely sealed passive device.

About us

  Sinda thermal is a very professional and experienced heat sink manufacturer in China, our factory was founded in 2014, and we have full experiences in manufacturing various heat sinks, coolers such as aluminum extreded heat sinks, skived fin heat sinks, vapor chambers, CPU coolers, zipper fin heat sinks, heat pipe heat sinks, etc. We own a extraordinary engineering team so we can provide our customer the professional service and products; we have sufficent facilities and equipment to support various demand from our customer around the world; we have passed through the ISO9000, Rohs, CE certifications. Sinda Thermal is devoted to supplying varieties of thermal solutions to the customers.

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