How does Micropumps application in cooling system
Micropumps are designed to move small amounts of fluid, such as liquids or gases, at low flow rates or volumes, and can be used in various applications that require precise and controllable small-scale fluid movement. Micropumps are suitable for various applications due to their small size, low power consumption, and the ability to accurately transport small fluid volumes.
Micropumps are used in microfluidic cooling systems to drive the circulation of coolant (usually liquid) through microchannels or heat exchangers integrated in electronic devices. These systems can effectively dissipate heat and maintain the optimal operating temperature of electronic components. Micropumps are key components in compact liquid cooling solutions for electronic devices. Micropump cooling systems are commonly used for liquid cooling in consumer electronics, chip cooling, and data centers,etc.
With the increase in processor power density and the improvement of heat dissipation requirements, air cooling is beginning to face great difficulties. Liquid cooling technology has begun to be applied and gradually developed into a more efficient and reliable server cooling method. A compact and efficient DC brushless micropump (TDC). By combining an ultra-thin micropump with a leak free cooling plate, fluid can be accurately transported to the cooled processor, maximizing the utilization of available space for efficient liquid cooling of the processor and achieving streamlined airflow management of the server chassis.
In addition, micropumps are also used in integrated CPU liquid -cooled cooling systems. The water-cooled head is attached to the CPU, and the coolant in the water-cooled head carries away the heat from the CPU. Then, the micropump drives the coolant to transfer the heat to the heat exchanger, which then dissipates the heat into the air. The micropump then circulates the water back to the water-cooled head. This widely used cooling system for high-performance PCs, after further miniaturization of pump and heat exchanger components, is being built into laptops for cooling high-performance processors.
The research team unanimously believes that this new cooling system driven by an integrated micropump has a compact and efficient structure, providing a promising solution for the thermal management of high-power and miniaturized electronic devices.
