How dos the vapor chamber cooler works
Vapor Chambers are flat thermal solutions used in place of heat spreaders to evenly and more efficiently diffuse heat from a source to a larger platform of area. The heat source outputs heat onto the vapor chamber, and the heat input vaporizes the working fluid inside the chamber, spreading to the entire inner volume, condensing over a large surface, cooling the vapor rapidly and transforming the vapor back to liquid. The liquid is transported back to the heat source via the structured lining the inner wall of the chamber.
Overall, vapor chambers work much like a thermal (heat pipe), and much more efficient in dealing with high power (heat) sources. VC heatsink is usually used for electronic products that need small volume or rapid cooling. At present, it is mainly applicable to servers, high-end graphics cards and other products. It is a strong competitor of heat dissipation mode of heat pipe. The appearance of the vapor chamber is a flat plate-shaped object, the upper and lower parts are respectively provided with a cover close to each other, and the inner part is supported by a copper column. The upper and lower copper sheets of the VC are made of oxygen free copper, usually pure water as the working fluid, and the capillary structure is made by copper powder sintering or copper mesh process.
As long as the vapor chamber maintains its flat plate characteristics, the modeling outline depends on the environment of the applied heat dissipation module, and there is no restriction on the placement angle during use. In practical application, the temperature difference measured at any two points of the plate can be less than 10 ℃, which is more uniform than the heat pipe to the heat source. Therefore, the name of temperature equalizing plate comes from it. The thermal resistance of common temperature equalizing plate is 0.25 ℃ / W, which is applied to 0 ℃ ~ 150 ℃.
Due to the mature technology and low cost heat pipe cooling module, the current market competitiveness of vapor chamber is still inferior to that of heat pipe. However, due to the rapid thermal performance increase of the VC, its application is aimed at the market where the power consumption of electronic products such as CPU or GPU is more than 80W ~ 100W. Therefore, the vapor chamber is mostly customized products, which is suitable for electronic products requiring small volume or rapid heat dissipation. At present, it is mainly applicable to servers,cell phone, high-end graphics cards and other products. In the future, it can also be applied to the heat dissipation of high-end telecommunications equipment and high-power LED lamps.
