IGBT module has higher and higher requirements for heat pipe heatsink

      Generally, the  IGBT heat pipe heatsink in the market mainly include these types, such as fin assembly, heat pipes and base plates. A plurality of parallel grooves are machined on the base plate, and then the grooves are welded with the evaporation section of the heat pipe with solder.

     In current IGBT heat pipe heatsink technology, heat pipe evaporation section is buried in substrate groove and does not directly adhere to IGBT surface; In the working process, firstly, the heat on the surface of IGBT is exported through the substrate, then transmitted to the heat pipe and heat sink, and finally the heat is transferred to the air by convection through the heat sink.

      Due to the thermal resistance of the substrate itself and the thermal conductivity of the heat pipe is much greater than that of the substrate, the improvement of the thermal conductivity of the heat pipe radiator is limited and the heat dissipation performance is reduced. In addition, in the prior art, the evaporation section of the heat pipe is welded with the substrate groove, with large contact thermal resistance and high requirements for processing technology.

      With the increasing heating power of IGBT devices in various fields, the technical requirements for the majority of heat pipe heatsink manufacturers are becoming higher and higher. Continuous technical updates are needed to meet the higher and higher heat dissipation requirements. Sinda Thermal has a professional R & D and design team dedicated to developing more professional and efficient heat dissipation technology and providing better thermal solutions, please contact with us if you have any thermal issues.