Liquid Assist Air Cooling

What is LAAC:

LAAC means Liquid Assist Air Cooling, In LAAC, liquid (typically a PG-Water) is pumped in a closed loop through liquid cold plates and a large radiator/heat exchanger. The requirement for liquid cooling at the CPU is growing due to TDP increases, T-case reductions, system density trends, and other system component power trends (e.g. accelerators, memory, and storage).

In some systems, liquid cooling loops cannot be utilized directly and requires the loop exchanges the heat directly to the air stream. In these cases, the Liquid Assisted Air Cooling (LAAC) is used to remove high amounts of power from the chips while rejecting the heat immediately into the air stream. This liquid assisted cooling offers customers the ability to cool the latest chips available in the market.

Advantages:

Liquid Assist Air Cooling another alternative thermal solution of liquid cooling, and it has many advantages combines both air cooling and liquid cooling:

1. High efficiency thermal conductivity, can support up to 300-500W per CPU

2. High reliability, no leakage risk with mature and stable process

3. Low power consumption, usually less than 10W

4. Low noise when working

5. Lighter than liquid cooling plate

6. Cost effective

Applications:

Computer Case, Heat Exchanger, Radiator, Condencer, Oil cooler, etc.

Product Features:

Packaging & Delivery:

Packaging Details: High performance cooling systems usually packed in wooden box, carton, or as per request.

Shipping Port: HongKong or ShenZhen, China

Lead Time: Sample lead time will takes about 30 days, and another 3-5 days transportation time by express air shipment.

Certifications:

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