Intel promotes multiple innovations to cool next-generation chips with up to 2000W power
According to Intel's official website, Intel researchers are exploring novel solutions to cool next-generation chips with powers up to 2000W. Intel said it will address the thermal challenges of next-generation chips through "new materials and structural innovations."
These solutions range from improvements in 3D vapor chambers (vapor chamber radiators) and jet liquid cooling, to optimized designs related to immersion cooling.
Intel plans to promote nucleation point density in two-phase cooling through improved boiling coatings, improve the nucleate boiling capability of the vapor chamber working fluid, and reduce contact thermal resistance. Going further, the researchers plan to significantly expand the application range of this ultra-low thermal resistance 3D vapor chamber.
After years of application exploration, Intel believes that immersion liquid cooling is an excellent, environmentally friendly and low-carbon cooling solution. Intel is working with liquid cooling industry suppliers to innovate designs in immersion cooling.
There are some studies showing that coral-shaped heat sinks with internal groove-like features have the highest potential for external heat transfer coefficients in two-phase immersion cooling. Intel envisions using additive manufacturing (AM) to realize coral-shaped heat sinks and envisions integrating 3D vapor chamber cavities into these immersed cooling heat sinks to improve heat transfer capabilities.
Separately, Intel researchers are also looking to improve microfluidic jet arrays to cool high-power chips. They envision a fluid nozzle that could be integrated with a standard chip package lid, with AI-regulated cooling jets sprayed directly onto the chip surface, eliminating thermal interface material and lowering thermal resistance.
Intel said that as multi-chip modules become increasingly difficult to cool, this technology can be customized for each structure, effectively targeting hot spots for cooling, allowing processors to run at lower temperatures and perform at the same power. Increase by 5% to 7%.
