Aluminum Zipper Fin Copper Base Heat Sink
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Aluminum Zipper Fin Copper Base Heat Sink

Aluminum Zipper Fin Copper Base Heat Sink

Zipper fin stucture heatsink is the ideal thermal solution for high power air forced convection devices, a zipper stacked fins are produced by high speed stamping machine to fold the metal sheets and zipper them together. For a soldering heatsink assembly, each component is designed by take advantage the material properties to optimize the thermal performance, aluminum zipper fin copper base heatsink is the classical example: The function of zipper fins is to dissipate the heat to air, as aluminum dissipates the heat faster than copper, and it has cheaper cost, more lightweight characters, aluminum zipper fins is the most considerable option; Copper is a better thermal conductor than aluminum, so it's used to produce the contact base to absorb and spread the heat rapidly, to improve the heat transferring efficiency, we also will embed some heatpipes for high power applications.

Product Introduction

  When it comes to keeping electronic devices cool, an efficient heat sink is crucial. One option that is becoming increasingly popular in the electronics industry is the aluminum zipper fin copper-based heat sink. This innovative design provides a range of benefits for cooling electronics and ensuring optimal performance.

 

  First and foremost, using aluminum in heat sink construction offers several advantages. Aluminum is a lightweight and durable material, making it ideal for heat sink applications. The use of aluminum also ensures that the heatsink is corrosion-resistant, which is important to ensure a long service life and reliable performance.

 

  The addition of a copper base to the heat sink further enhances its thermal conductivity. Copper is known for its ability to transfer heat efficiently, making it a valuable material for heat sink construction. By combining aluminum with a copper base, the heat sink effectively dissipates heat from electronic components, ensuring they remain within safe operating temperatures.

 

  One of the key features of the aluminum zipper fin heat sink design is its greater surface area. Unique zipper fin design creates greater heat dissipation surface area for improved thermal performance. This means the heatsink effectively draws heat away from the electronic components, preventing overheating and potential damage.

 

  In addition to excellent cooling performance, aluminum zipper fin radiators offer a compact and space-saving design. This is particularly advantageous in applications where space is limited, as the heat sink can be effectively integrated into compact electronic devices without compromising performance.

 

  Another advantage of the aluminum zipper fin copper-based heat sink is its versatility. This type of radiator can be customized to meet specific requirements, with a choice of different fin densities, sizes and configurations. This flexibility allows the heat sink to be customized according to the cooling needs of different electronic devices, ensuring optimal thermal management.

 

  Additionally, the use of aluminum in the heatsink construction makes it an environmentally friendly choice. Aluminum is a highly recyclable material, meaning radiators can be recycled and reused at the end of their life, reducing the environmental impact.

 

 

Product specifications

Material Aluminum and copper  Certificates ISO 9001:2015,ISO 14001:2015
Product dimension Customized Type Soldering heat sink
Process Stamping, CNC, soldering Lead time 4 weeks
Surface finish Passivation, nickel plating Packing Tray, carton
OEM/ODM Yes Quality control 100%
Application CPU, inverter,IGBT,LED,etc. Warrantly 1 year



Varieties of heat sink

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink


Thermal simulation

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink


Factory and workshop

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink


Certificates

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink

 

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink


 

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink



  Sinda Thermal is a leading thermal manufacturer in China, our factory was founded in 2014, and located in Dongguan city, China, we are offering varieties of heatsinks and other precious metal parts. Our plant possesses 30 sets advanced and high precious CNC machines and stamping machines, also we have many testing and experiment instruments and professional engineering team, so our company can manufacture and provide high quality products with high precision and excellent thermal performance. Sinda Thermal is devoted to a range of heat sinks which are widely used in new power supply, New energy vehicles, Telecommunications, Servers, IGBT, and Madical. All the products accord with Rohs/Reach standard, and the factory is qualified by ISO9001 and ISO14001. Our company has been a partner with many customers for good quality, excellent service and competitive price. Sinda Thermal is a great heat sink manufacturer for the global customers .


FAQ
1. Q: Are you a trading company or manufacturer?
    A: We are a leading heat sink manufacturer, our factory has been founded over 8 years, we are professional and experienced.

2. Q: Can you provide OEM/ODM service?
    A: Yes, OEM/ODM are available.

3. Q: Do you have MOQ limit?
    A: No, we don't set up MOQ, prototype samples are available.

4. Q: What's the lead time of the production?
    A: For prototype samples, the lead time is 1-2 weeks, for mass production, the lead time is 4-6 weeks.

5. Q: Can I visit your factory?
    A: Yes, Welcome to Sinda Thermal.

 

 

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