Major breakthrough in chip cooling technology: scientists improve the performance of cooling system by 50 times
You may have experienced that when your mobile phone is running a large game or your computer is running video editing software, they may be too hot, and the game will jam, and the video editing software will not respond. All these reasons are more or less related to the heat dissipation performance of electronic circuits in electronic equipment.
Nowadays, thermal management has become one of the mainly challenges facing electronic products in the future. With the continuous improvement of data generation and communication speed, as well as the continuous reduction of industrial device size and cost, the power density of electronic products has been increasing, and the cooling of electronic circuits has become very challenging.
At present, because the heat dissipation performance of liquid cooling is much better than that of air cooling metal radiator, liquid heat dissipation technology is gradually applied to high-power devices or high-performance computing chips. However, this liquid must be an insulator and cannot have any chemical reaction with electronic components. Moreover, although the liquid cooling system can be used to cool electronic devices, the traditional liquid cooler can produce problems such as temperature gradient and high energy consumption.
Embedding liquid cooling system into microchip is an attractive method, but the current design of chip and cooling system limits the efficiency of cooling system. The heat generated by electronic products is controlled by embedding the liquid cooling system directly into the electronic chip. Compared with the traditional electronic cooling method, the cooling performance of this method can reach 50 times of the traditional design. It is a promising, sustainable and cost-effective method.
The researchers said that by eliminating the need for large external radiators, this method can integrate more compact electronic devices (such as power converters) into one chip.When the system operates, the temperature will only rise by about 1 / 3 ℃ for each watt of electricity output. As its heat resistance has been improved to 60 ℃, wgich means that the equipment can absorb 176 watts of energy and the required water flow is less than 1 ml per second.
Researchers said that at present, about 30% of the energy of the data center is used for cooling, and about 100 billion liters of water are used every year. If this design is adopted, the energy required for cooling is expected to be reduced to less than 1% of the current value.
In fact, we are still a long way from this goal. However, researchers have taken a big step towards developing low-cost, ultra compact and energy-efficient power electronic cooling systems. Their methods are superior to the current state-of-the-art cooling technology, and may make the equipment generating high heat flux a part of our daily life.
Sinda Thermal will keep following in all the new technology of thermal management, and provide more effective, high performance solutions in different fields. Please contact us if you need any help on your thermal products.
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