Smart Cell Phone cooling ways
The performance of mobile phone chips is getting stronger and stronger, and the power consumption and heat generation are also increasing. When the mobile phone runs under high load, the temperature rises, and the CPU will "protectively reduce the frequency". As a result, the performance will be reduced, the game frame will be dropped, and the operation efficiency will be low. In fact, with the development of cooling technology, more and more thermal solution are used in the cell phone applications.
Graphite Cooling:
As a kind of metal material with thermal conductivity higher than that of steel, iron, lead and other metals, graphite is used in mobile phones and flat plates of major brands. It has good characteristics such as high temperature resistance, electrical and thermal conductivity, chemical stability, plasticity and thermal shock resistance. The graphite heat sink used in mobile phone heat dissipation is a good heat conduction and heat dissipation material with unique grain orientation and uniform cooling, The sheet structure can be well applied to any surface.
Metal Backplate Cooling:
Based on the use of graphite cooling film, a layer of metal back plate is also designed inside the metal shell, which can directly transfer the heat derived from graphite to all corners of the metal body through this layer of metal heat conduction plate. In this way, the heat in the confined space can quickly disperse and disappear, and people will not feel too much heat when holding.
Thermal Grease Cooling:
Silicone grease is a paste made of special silicone oil as base oil, new metal oxide as filler and a variety of functional additives. Good heat conduction, temperature resistance and insulation are the ideal transmission medium for heatsinks. Before installing the CPU and the heat sink, apply a layer of thermal grease on the CPU surface , whick will help the heat of the CPU can be quickly transferred to the outside of the heatsink.
Heatpipe Cooling:
The heat pipe cooling used in mobile phones is also extends from the PC field. Theheat pipe cooling technology is to cover the apex of a liquid filled heat conducting copper pipe on the mobile phone processor. When the processor calculates and generates heat, the liquid in the heat pipe absorbs heat and gasifies. These gases will reach the heat dissipation area at the top of the mobile phone through the heat pipe, cool and condense, and then return to the processor again and again, so as to effectively dissipate heat.
Vapor Chamber cooling:
Vapor Chamber has a wide range of applications. It is especially suitable for the heat dissipation demand in the narrow space environment where the height space is strictly limited. Such as notebook computers, computer workstations , cell phones and network servers. With the trend of lightweight downstream consumer electronics, the demand for vapor chamber is expected to increase.
No matter what kind of thermal material and thermal cooling method is used, its purpose is to reduce the working temperature of the equipment and improve the stability. To improve the heat dissipation problem, both hardware and software need to be improved to produce synergy.
