The future development of vapor chamber
At present, the main methods for manufacturing the two-dimensional thermal capillary structure of the vapor chamber are not only sintering, copper mesh, but also grooves, metal film and other methods. In terms of technological development, how to further reduce the thermal resistance of the soaking plate and enhance its heat conduction effect in order to match with lighter fins such as aluminum has always been the goal of R&D personnel. Increasing the production yield in production and looking for a reduction in the cost of overall thermal solutions are all the directions of the industry's development. In terms of product application, the soaking plate has expanded from one-dimensional to two-dimensional heat conduction compared to the heat pipe. In the future, to solve other possible heat dissipation applications, the soaking plate solution is being developed one after another. Practically speaking at the present stage, how to expand the application market of the products that have been developed is an urgent task for the current vapor chamber industry.
Let's emphasizing again to summarize the concept and application scenarios of the 3D vapor chamber:
The vapor chamber is a kind of flat heat pipe, which can quickly transfer and spread the heat flow gathered on the surface of the heat source to the large area of the condensing surface, thereby promoting the dissipation of heat and reducing the heat flow density on the surface of the components.
The structure of the vapor cahmber: a completely closed flat cavity is formed by a bottom plate, a frame and a cover plate. The inner wall of the cavity is equipped with a liquid-absorbing capillary core structure. The capillary core structure can be metal wire mesh, micro grooves, fiber filaments, It can also be a metal powder sintered core and several structural combinations. If necessary, the cavity needs to be provided with a supporting structure to overcome the deformation of depression and heat expansion caused by vacuum negative pressure.
The advantages of the vapor chamber: the small size can make the radiator control as thin as the entry-level low power consumption; the heat conduction is fast, and it is less likely to cause heat accumulation. The shape is not limited, it can be square, round, etc., adapting to various heat dissipation environments. Low starting temperature; fast heat transfer; good temperature uniformity; high output power; low manufacturing cost; long service life; light weight.
Application of vapor chamber in the computer field: The vapor chamber is mostly a customized product, which is suitable for electronic products that require small volume or need to quickly dissipate high heat. At present, it is mainly used in servers, tablet computers, high-end graphics cards and other products. In the future, it can also be used in high-end telecommunications equipment, high-power brightness LED lighting, etc. for thermal solutions.
