The heat dissipation of 5G base stations is inseparable from high thermal conductivity materials!

      In the mobile communication network, the heat generated by the base station is increasing, and the difficulty of temperature control is also rising. The power consumption of a 5G base station is 2.5 to 4 times that of a 4G base station, which is mainly generated by the AAU and BBU performing signal conversion, processing and transmission. The rise in base station power consumption means an increase in heat generation. If the heat is not timely, it will cause the internal environment temperature of the base station to rise. Once the rated temperature is exceeded, it will seriously affect the stability of the network and the service life of the equipment.  

      5G base stations are usually installed on iron frames on the roofs of buildings and high places in the field. Therefore, reducing the size and weight of the equipment is essential for the convenience of installation. This will inevitably bring greater challenges to the heat dissipation of 5G base stations. In order to better solve the heat dissipation problem of 5G base stations, it is required to increase the heat exchange efficiency of the base station as much as possible and reduce the heat transfer resistance in a limited space. In addition to optimizing the heat sink design, adopting liquid cooling methods, new heat dissipation materials or reasonable chip layouts, high thermal conductivity materials with higher thermal conductivity and lower thermal resistance are also required, so that the heat of the heat source can be transferred to the heat dissipation shell more quickly .

       In view of the high thermal conductivity requirements of 5G base stations for thermal conductive materials, the main recommended materials are: TIF800 thermally conductive silicone sheet, Z-Paster100-30-10S silicon-free thermally conductive sheet, and TIG780-38 thermally conductive silicone grease.