The importance of thermal simulation for heatsink design
Most electronic components will heat when current flows through them. Heat depends on power, device characteristics and circuit design. In addition to components, the resistance of electrical connections, copper wiring and through holes can also cause some heat and power losses. In order to avoid failure or circuit failure, PCB designers should be committed to producing PCBs that can work normally and remain within the safe temperature range. Although some circuits can work without additional cooling, in some cases, the addition of radiators, cooling fans or a combination of mechanisms is inevitable.
Why do we need thermal simulation?
Thermal simulation is an important part of electronic product design process, especially when modern ultrafast components are used. For example, FPGA or fast AC / DC converter may easily dissipate several watts of power. Therefore, PC boards, enclosures and systems must be designed to miniaturize the impact of heat on their normal operation.
We can use specialized software that allows designers to enter 3D models of the entire device - including circuit boards with components, fans (if present) and enclosures with vents. Heat sources are then added to the simulation components - usually to IC models, which generate enough heat to attract attention. Environmental conditions are specified, such as air temperature, gravity vector (for convection calculation), and sometimes external radiation load. Then simulate the model; The results usually include temperature and airflow diagrams. In the enclosure, it is also important to obtain a pressure map.
The configuration is completed by inputting various initial conditions - ambient temperature and pressure, the nature of the coolant (air at 30 ° C in this case), the direction of the circuit board in the earth's gravity field, etc., and then we run the simulation. In order to perform the simulation, the software slices the whole model into a large number of units, each of which has its own material and thermal characteristics and the boundary with other units. It then simulates the conditions within each element and slowly propagates them to other elements according to the specification of the material. Thermal simulation and analysis will contribute to better PCB design.
