The structure and application of the Vapor Chamber
Copper mesh diffusion bonding and composite microstructure
Different from the heat pipe, the uniform temperature plate product is first vacuumed and then injected with pure water to fill all the microstructures. The filling medium does not use methanol, alcohol, acetone, etc., but uses degassed pure water, there will be no environmental protection problems, and the efficiency and durability of the uniform temperature plate can be improved. There are two main types of microstructures in the uniform temperature plate: powder sintering and multilayer copper mesh, both of which have the same effect. However, the powder quality and sintering quality of the powder sintered microstructure are not easy to control, and the multi-layer copper mesh microstructure is applied with diffusion bonding copper sheets and copper meshes on the uniform temperature plate, and its pore size consistency and controllability are better than powder sintering The microstructure and quality are relatively stable. The higher consistency can make the liquid flow more smoothly, which can greatly reduce the thickness of the microstructure and reduce the thickness of the soaking plate. The industry already has a plate thickness of 3.00mm with a heat transfer capacity of 150W. Using copper powder sintered micro-structured soaking plate, because the quality is not easy to control, the overall heat dissipation module usually needs to be supplemented by the design of heat pipes.
The bonding strength of the diffusion-bonded multilayer copper mesh is the same as that of the base material. Because of the high air-tightness, no solder is needed, and there will be no microstructure blockage during the bonding process. Better quality and longer durability. After the diffusion bonding method is used, if the hole leaks, it can also be repaired by heavy work. In addition to bonding the multilayer copper mesh by diffusion, the hierarchical design of joining the copper mesh with a smaller aperture near the heat source can also make the evaporation zone pure water replenish quickly, and the circulation of the overall uniform temperature plate is smoother. More advanced people make the micro-structure modularization as a regional design, which can be applied to the heat dissipation design of multiple heat sources. Therefore, the uniform temperature plate designed with diffusion bonding and regionalized hierarchical design greatly increases the heat flux per unit area, and the heat transfer effect is better than that of the sintered microstructure uniform temperature plate.
Application of uniform temperature board on computer
As the heat pipe cooling module technology is relatively mature and the cost is low, the current market competitiveness of the temperature equalizing plate is still inferior to the heat pipe. However, due to the fast heat dissipation characteristics of the uniform temperature plate, its current application is aimed at the market where the power consumption of electronic products such as CPU or GPU is above 80W-100W. Therefore, the temperature equalizing plate is mostly a customized product, which is suitable for electronic products that require a small volume or need to quickly dissipate high heat. At present, it is mainly used in products such as servers and high-end graphics cards. In the future, it can also be used in high-end telecommunications equipment, high-power brightness LED lighting, etc. for heat dissipation.
The future development of the uniform temperature board
At present, the main methods for manufacturing the two-dimensional heat dissipation capillary structure of the uniform temperature plate are not only sintering, copper mesh, but also grooves and metal thin films. In terms of technological development, how to further reduce the thermal resistance of the soaking plate and enhance its heat conduction effect in order to match with lighter fins such as aluminum has always been the goal of R&D personnel. Increasing the production yield in production and looking for a reduction in the cost of overall heat dissipation solutions are all the directions of the industry's development. In terms of product application, the soaking plate has expanded from one-dimensional to two-dimensional heat conduction compared to the heat pipe. In the future, to solve other possible heat dissipation applications, the soaking plate solution is being developed one after another. Practically speaking at the present stage, how to expand the application market for the products that have been developed is the most urgent task for all the current average temperature board industry.
Let's knock on the blackboard again to summarize the concept and application scenarios of the 3D uniform temperature board:
The uniform temperature plate is a kind of flat heat pipe, which can quickly transfer and diffuse the heat flow gathered on the surface of the heat source to the large area of the condensing surface, thereby promoting the dissipation of heat and reducing the heat flow density on the surface of the components.
The structure of the temperature equalization plate: a completely closed flat cavity is formed by a bottom plate, a frame and a cover plate. The inner wall of the cavity is equipped with a liquid-absorbing capillary core structure. The capillary core structure can be a metal wire mesh, a micro groove, and a fiber wire. It can also be a metal powder sintered core and several structural combinations. If necessary, the cavity needs to be equipped with a supporting structure to overcome the deformation caused by the depression and heat expansion due to the vacuum negative pressure.
The advantages of the temperature equalizing plate: the small size can make the radiator control as thin as the entry-level low power consumption; the heat conduction is fast, and it is less likely to cause heat accumulation. The shape is not limited, it can be square, round, etc., adapting to various heat dissipation environments. Low starting temperature; fast heat transfer; good temperature uniformity; high output power; low manufacturing cost; long service life; light weight.
Application of uniform temperature board in the computer field: Most uniform temperature boards are customized products, which are suitable for electronic products that require small volume or need to quickly dissipate high heat. At present, it is mainly used in servers, tablet computers, high-end graphics cards and other products. In the future, it can also be used in high-end telecommunications equipment, high-power brightness LED lighting, etc. for heat dissipation.
