Thermal conductive interface material
1. Concept of thermal conductive interface material:
Thermal interface materials, also known as thermal interface materials or interfacial thermal conductive materials, are widely used in IC packaging and electronic heat dissipation. They are mainly used to fill the micro voids and uneven holes on the surface when the two materials are joined or contacted, reduce the heat transfer contact thermal resistance and improve the heat dissipation performance of devices.
2. Importance of thermal conductive interface materials in the industry:
There is a very small gap between the surface of Microelectronic Materials and the radiator,Using thermal interface materials with high thermal conductivity to fill these gaps, eliminate the air in them, and establish an effective heat conduction channel between electronic components and radiator can greatly reduce the contact thermal resistance and give full play to the role of radiator.Thermal interface materials play a key role in thermal management system.
3. Characteristics of ideal thermal conductive interface materials:
a: hign thermal conductive
b: High flexibility and toughness ensure well contact of the thermal
interface material and heatsource under low installation pressure.
c: Insulation
d: easy to apply and removable
e: Wide applicability
4. Application fields of thermal conductive interface materials:
LED: Induction cooker, spotlight, display screen, chandelier, stage lamp,etc
computer & Home video equipment: Graphics card, notebook, computer, speaker, DVD, VCD TV,etc
Electronic appliances: Refrigerator, washing machine, induction cooker, rice cooker, microwave oven, etc
Other instruments: medical devices,CPU assembly,temperature sensors,power modules, electronic products,etc
5.Types of thermal conductive interface materials:
thermal grease
thermal PAD
Phase change material
Double sided thermal conductive material
Thermal conductive tape
6. How to chose the suitable thermal conductive materials?
Firstly, the type of thermal material is determined according to the customer's application; Secondly, the appropriate thermal conductive interface material is selected according to the thermal conductivity, thickness, size, density, voltage resistance, service temperature and other parameters of the product. The selection of thickness is related to the gap size at the Tim position where the customer needs to solve the heat dissipation products and the density, hardness, compression ratio and other parameters of Tim products. We recommend to determine the specific parameters after sample testing. Sinda thermal provides various thermal solutions on heatsink deaign and thermal conductive material selection , we are professional in thermal product manufacture and ODM/OEM service.
