Thermal management of 5G cell phone
The 5G market is developing rapidly, and 5G smart phones have been widely used. At present, global electronics manufacturers are competing fiercely in the 5G smartphone market in terms of technology and product quality.
Implementation of 5G cellular signal and large-scale MIMO operating at higher millimeter wave frequency; Market demand for lighter, thinner and faster equipment; The circuits in the equipment become more dense, and the requirements for lighter, thinner and better elongation of thermal management materials are increasing.
In 5G smart phones, managing heat and temperature is crucial to prolong service life (especially for components). The solution to the thermal management challenge must be at the board level, circuit design / operation level and through the use of active thermal management solutions.
CPU thermal PAD cooling:
In smart phones, intensive application processors, power management circuits and camera modules are the main heat sources. AP contains several sub components, such as GPU, multimedia codec, especially CPU, which generates the most heat. At present, the more common solution is to use thermal conductive adhesive on the mobile phone CPU, which can effectively transfer most of the heat to the heat dissipation parts for cooling, and the cost is low.
PMIC thermal grease cooling:
PMIC – power management IC is one of the components known to generate a lot of heat during the operation of smart phones.
For thermal management of performance components such as power management IC, ram and image processor, thermal grease have good thermal conductivity, physical stability under vibration and temperature cycles, and can alleviate stress.
Gernal components Graphite sheet cooling:
The graphite sheet can evenly transfer the heat generated by the CPU on the mobile phone motherboard PCB to the metal support and frame. At the same time, the heat from the high heat CPU chip can quickly spread to the plane of the whole graphite sheet.
The graphite sheet on the back plate of the battery compartment also has the function of evenly distributing heat to the touch screen and emitting battery heat. It solves the problem that it will be hot to use for a long time.
Thermal insulation of 5g antenna:
The complex 5G mmwave antenna module incorporates power amplifiers that generate heat near the edge of the device. Due to space constraints, it is difficult to reduce the surface temperature by increasing the air gap, and throttling will damage 5G performance. Traditional cooling solutions are also not an option because they are conductive and interfere with RF signals. The use of heat insulation pad can not only effectively insulate the antenna module, but also insulate it.
