Thermal PAD application on exchanger
Chassis cooling system:
Generally speaking, the heat dissipation system of the exchanger is divided into two types: front air inlet, rear air outlet, left air inlet and right air outlet. These two heat dissipation systems are similar. Because of different structural design, different heat dissipation wind directions are formed. There are also some strange designs on the market. Obviously, it is the front air inlet and rear air outlet type, but the fan is installed on the side. This design is obviously unreasonable, which greatly shortens the service life of the switch. Scientific structural design is the premise to ensure good heat dissipation.
Thermal PAD:
Thermal conductive PAD is mainly used for thermal conduction and heat dissipation between the main board and the shell. The main purpose of selecting thermal PAD is to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator. The thermal conductive PAD can well fill the gap of the contact surface; Thermal PAD not only has insulation performance, but also has the effect of shock absorption and sound absorption.
The heat dissipation system needs to make a scientific and reasonable layout of thermal PAD, heat sinks, fans, CPUs and other components, so as to ensure good heat dissipation and improve the stability of the exchanger.
Sinda Thermal has rich experience in providing thermal solution design for various applications for customer. We can provide varieties heatsinks and coolers which inlcuding aluminum extruded heatsink, high performance heatsink, copper heatsink, skived fin heatsink, liquid cooling plate and heat pipe heatsink. please contact us if you have any questions about thermal solution.
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