Socket 775 Cpu Cooler

Product introduction:

1.        The fin folding and opening technology ensures that the fins are invariable or stacked. Except for the top fin, all other fins are designed with openings. The air duct is smooth and the heat exchange is fast.

2.        9CM large air volume fan, with a beautiful appearance, it can be applied to most 65W TDP CPUs, and the heat dissipation efficiency is effectively improved

3.        The heatsink adopts a position avoidance design to meet the needs of most users and has good compatibility

4.        The heat pipe and fins adopt a tight-fitting process to effectively improve the heat transfer efficiency

5.        The radiator is equipped with Shin-Etsu 7762 thermal paste to fully improve product performance.

Compatible with Intel CPUs:

Intel LGA 775/LGA 1200/LGA 1150/1151/1155/1156

Compatible with AMD CPUs:

AMD socket 754/939/940 FX series

Heatsink module spec

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