Thermal solution for semiconductor laser machine

  Semiconductor laser welding machine is an equipment which commonly used in electronic industry, it utilizes the excellent directionality and high power density of semiconductor laser beam for welding work. The working principle is to focus the laser beam in a very small area by the optical system, and to create a highly concentrated heat source with high temperature in the welding area within a short time, so that the welding material melts and forms a solid welding joint.

  As the primary component of the semiconductor laser welding machine, semiconductor laser is the one of the most widespread optoelectric device currently. With the increasing improvement of the technology and productioin capacity, it can be applied to more industries. Semiconductor laser is the main device which uses semiconductor materials as working material. Due to the different material structure, the laser beam generated will be different. The trait of semiconductor laser equipment is small volume and long working life, in addition of the communication industry, it's also widely used in radar, sound-measuring device, and medical equipment.

  Due to the large power of the chip, it will generate huge heat when it's working, if the heat dissipation could not be done well, the performance of the chip would be affeted, even worse, it may be damaged. So a heat sink is essential for a semiconductor laser equipment.

  Laser device cooling method classification  

  Currently, the main cooling solutions of laser equipment are divided into traditional cooling solution and new cooling solution. Traditional cooling solution includes air cooling and liquid cooling; The new cooling solution includes: inverted cooling, microcardinal cooling.

  Liquid cooling is to utilize water or other liquid as the mediumto take away the heat, which consists of cold plate, tube, coolant, heat exchanger, pump, etc. When the cold plate absorbing the heat from the laser device and releasing it to the coolant, then the coolant will take the heat to the heat exchanger and dissipate it. Liquid cooling can solve the high power laser equipment thermal issues, which is more and more widely used in industry cooling, servers, Telecommunications, inverters, etc.

  Air cooling usually uses good thermal conductivity material to remove the heat from the laser equipment and dissipate it to the air, for the high power laser device, the heat sink is often composed of copper pedestal, heat pipes, and aluminum fins, this type of heat sink can ultimately utilize the advantages of the materials.