Thermally conductive silicone sheet is a material that can not be ignored to solve the heat dissipation of 5G communication base stations

          The rapid development and application of 5G will drive mobile communications with all walks of life, such as autonomous driving, smart cities, artificial intelligence, industry, and the Internet of Everything. Hypotheses that are currently in the experimental or theoretical stage will be popularized or realized. Behind the data transmission rate that is 10 times faster than 4G, there are more base stations, greater power, and exponentially increasing heat generation. Heat dissipation is the most important issue.         

          In such a small and enclosed space of a communication base station, how to quickly conduct heat to achieve the purpose of heat dissipation? This requires a reasonable heat dissipation design. Thermal management needs to rely on heat conduction to transfer heat to the external heat dissipation teeth, and use sufficient heat dissipation area to dissipate heat. However, the heating module on the PCB cannot be completely attached to the heat sink. There is a small gap between the two, and the contact thermal resistance is large. , The heat conduction speed is slow, so it is necessary to add a thermal interface material-thermally conductive silicone sheet to increase the heat dissipation effect.

          The thermal conductive silicone sheet fills the air gap between the heating element and the heat sink or the metal base. Its flexibility and elasticity make it possible to cover very uneven surfaces. Its excellent performance allows heat to be conducted from the heating device or the entire PCB to the metal casing or diffusion plate, thereby improving the efficiency and service life of the heating electronic components. With self-adhesive without additional surface adhesive, it provides a variety of thickness and hardness options, low thermal resistance, and high flexibility.