Vapor Chamber application in thermal industry
The vapor chamber is a vacuum cavity with fine structure on the inner wall, which is usually made of copper. When the heat is transmitted from the heat source to the evaporation zone, the coolant in the cavity begins to vaporize after being heated in the environment with low vacuum. At this time, it absorbs heat energy and expands rapidly. The gas-phase cooling medium quickly fills the whole cavity. When the gas-phase working medium contacts a relatively cold zone, condensation will occur. The heat accumulated during evaporation is released by the condensation phenomenon, and the condensed coolant will return to the evaporation heat source through the microstructure capillary pipe. This operation will be repeated in the cavity.
Basic Details:
Material: copper, stainless stell ,titanium alloy
Strecture: Vacuum cavity with fine structure on inner wall
Applications； Server, telecom, 5G, Medical equipment , LED, CPU,GPU,etc
Thermal resistance: 0.25℃/W
Operation temperature：0-150℃
Process Description:
Different from the heat pipe, vapor chamber product is made by vacuuming and then injecting pure water, so that all microstructures can be filled. The filling medium does not use methanol, alcohol, acetone, etc., but uses degassed pure water, which will not have environmental protection problems, and can improve the efficiency and durability of the temperature equalizing plate.
There are two main types of microstructure in the vapor chamber : powder sintering and multilayer copper mesh, which have the same effect. However, the powder quality and sintering quality of powder sintered microstructure are not easy to control, while the multi-layer copper mesh microstructure is applied with diffusion bonded copper sheet and copper mesh above and below the vapor chamber its aperture consistency and controllability are better than that of powder sintered microstructure, and the quality is more stable. The high consistency can make the liquid flow more smoothly, which can greatly reduce the thickness of microstructure and the thickness of soaking plate.
The industry has a plate thickness of 3.00mm at 150W heat transfer. Because the quality of vapor chamber with copper powder sintered microstructure is not easy to control, the overall heat dissipation module usually needs to be supplemented by the design of heat pipe.
Applications:
Due to the mature technology and low cost of thermal module of heat pipe, the current market competitiveness of vapor chamber is still inferior to that of heat pipe. However, due to the rapid heat dissipation characteristics of the vapor chamber its application is aimed at the market where the power consumption of electronic products such as CPU or GPU is more than 80W ~ 100W. Therefore, vapor chamber is mostly customized products, which is suitable for electronic products requiring small volume or rapid heat dissipation. At present, it is mainly used in servers, high-end graphics cards and other products. In the future, it can also be used in the heat dissipation of high-end telecommunications equipment and high-power LED lighting.
Advantages:
The small volume can make the heatsink module control as thin as the entry-level low power consumption; Heat conduction is fast, which is less likely to lead to heat accumulation. The shape is not limited, and can be square, round, etc., which is suitable for various heat dissipation environments. Low starting temperature; Fast heat transfer speed; Good temperature equalizing performance; High output power; Low manufacturing cost; Long service life; Light weight.
